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American Semiconductor Launches Fully Flexible, Ultra Bluetooth IC

The Semiconductor-on-Polymer chip scale packaged system on chip supports Bluetooth Low Energy (BLE) communication.

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By: Anthony Locicero

Copy editor, New York Post

American Semiconductor, Inc. launched the new AS_NRF51822 FleX-BLE IC.

The Semiconductor-on-Polymer chip scale packaged system on chip supports Bluetooth Low Energy (BLE) communication. FleX-BLE is an ultra-thin and flexible SoP CSPversion of Nordic Semiconductor’s nRF51822 Multiprotocol Bluetooth Low Energy/2.4 GHz RF System on Chip. This feature-rich FleX-BLE product has an ARM CortexTM M0 processor, 256KB embedded Flash memory, 32KB RAM, encryption coprocessor, temperature sensor, and 10-bit analog-to-digital converter. The FleX-BLE operates from 1.8-3.6V.

“This is a key milestone for ultra-thin wireless electronics and we are already working with several customers who wish to utilize ultra-thin Bluetooth technology for their applications,” said Doug Hackler, president and CEO of ASI.

The American Semiconductor FleXTM Semiconductor-on-PolymerTM (SoP) wafer level chip scale packaging process is used to convert standard CMOS products into robust, thin and physically flexible form factors. 

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